Yamaichi has developed the first OSFP-XD connector in the market and demonstrated the 112G-PAM4 signal performance at Designcon2023 using the connector. OSFP-XD is a next generation pluggable module form factor with 120 contacts per port supporting 32 high speed lanes. This connector is companiable with 40 W modules and offers stable SI performance. The specification will be released soon by the OSFP MSA group.
The 112G OSFP connector is designed for high power current capacity applications in a wide range of cage variations such as 1x and 2x stacked. Our stacked OSFP connectors employ SMT mount design which offers advantageous SI performance. The CN176 Series has a current capacity of 2.5 A per pin which meets the current MSA 4.1 targets. With a power capability of 33 W, this connector is the ideal solution for your high-power data networking needs.
Additionally, Yamaichi has developed a 224G OSFP connector as part of our next generation 224G pluggable module solutions.
The 112G SFP-DD and 112G SFP connectors come from our CNU109S Series. The double density design offers 2 high-speed lanes and supports 112G-PAM4 signals. Its physical interface design is backward compatible with current SFP pluggable module (such as existing SFP cables, modules, and AOC’s) and new SFP-DD interfaces. This connector is SFP-DD MSA’s compliant and has been in mass production since 2020.
Yamaichi’s 112G SFP connectors are backwards compatible with previous SFP form factor modules, this high-speed connector gives designers superior performance over its predecessors. The footprint and mechanical dimensions are compatible with current SFP Spec and MSA design guidelines.
The 112G QSFP-DD connector is a part of our CN174 Series and offers various 1×1 – 1×6, and 2×1 stacked cage configurations. These high-power pluggable modules meet the market demand for high-power current capacity and superior thermal dissipation. It supports up to 44 W high power modules and 2.25 A of current per pin, surpassing the current MSA 6.0 current capacity targets.
Our high speed 112G QSFP Interconnect product line is part of our CN120 Series and complies with current design guidelines. We offer cages, heat sinks and heat sink clips for both connector types.
We offer a wide selection of CFP, CFP2, CFP8 connectors and accessories. Yamaichi’s CFP2, CFP4, and CFP8 connector family perform well at 200GbE and 400GbE high speed signal requirements specified with 28G-NRZ and 56G-PAM4 signaling as 200GAUI-8, 400GAUI-16, 200GAUI-4 and 400GAUI-8. WE have also developed CFP2-64G and CFP4-64G connectors to accommodate future requirements such as 64G-ACO modules and 112G-PAM4 channel. Both connectors and head sink modules (side to side & front to back) are available in single and dual slot designs. The entire CFP Interconnect series is CFP MSA Compliant.
Yamaichi is in the process of developing key next generation 224G module solutions for the series mentioned above. Our goal is to provide a one stop shop for your Data Networking needs including connects, cages, heat sinks, and clips with customizable options available. Be sure to check out our other DSFP, and NGSFP-DD 112G solutions.
Yamaichi Electronics is the global market leader in high-speed interconnect and various memory card solutions. Our products are widely used in many markets including General Consumer Electronics, Computing, Communication, Storage, Data Centers, Automotive Infotainment, and many more. Performance, Quality, and Service are the drivers behind Yamaichi Electronics’ success over the years.
Jeremy Sheridan | Sales Manager
Mobile: +1 (408) 966-1113
Direct: +1 (408) 715-9162